*********

R&D Software Test Engineer - Semiconductor Capital Equipment (Die Bonding)

phone

+65-6***-****

location

SCIENCE PARK ROAD 117528

email

***************

Verified 2 years ago

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Company Information

Company

industryWithGradientBESI SINGAPORE PTE. LTD.

Website

globe************

Registration Number

registerWithGradient198302438E

Year of incorporation

flag1983

Ownership

ownershipPrivate Limited Company

Industry Category

industryWithGradientMANUFACTURING

Industry Classification

industryWithGradientMANUFACTURE AND REPAIR OF SEMICONDUCTOR ASSEMBLY AND TESTING EQUIPMENT (INCLUDING COMPUTER BURN-IN SYSTEM)

Address

location1, SCIENCE PARK ROAD, THE CAPRICORN, #03-11, 117528, Singapore
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