*********

Vice President Die Attach Innovation

phone

+65-6***-****

location

SCIENCE PARK ROAD 117528

email

***************


Verified 1 years ago

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Company Information

Company

industryWithGradientBESI SINGAPORE PTE. LTD.

Website

globe************

Registration Number

registerWithGradient198302438E

Year of incorporation

flag1983

Ownership

ownershipPrivate Limited Company

Industry Category

industryWithGradientMANUFACTURING

Industry Classification

industryWithGradientMANUFACTURE AND REPAIR OF SEMICONDUCTOR ASSEMBLY AND TESTING EQUIPMENT (INCLUDING COMPUTER BURN-IN SYSTEM)

Address

location1, SCIENCE PARK ROAD, THE CAPRICORN, #03-11, 117528, Singapore
Experience
besi-singapore-pte-ltd

besi singapore pte. ltd.

Vice President Die Attach Innovation

Jan 2019 - Present
besi-singapore-pte-ltd

besi singapore pte. ltd.

Vice President Flip Chip

Feb 2014 - Present
besi-singapore-pte-ltd

besi singapore pte. ltd.

Global Key Account Manager

Jan 2012 - May 2014

BESI (BE Semiconductor Industries N.V.)

Director Wire Bonding, Services

Jan 2011 - Dec 2011

BESI (BE Semiconductor Industries N.V.)

Senior Manager

Apr 2008 - Dec 2010
oerlikon-metco-singapore-pte-ltd

oerlikon metco (singapore) pte. ltd.

Product Manager

Nov 2007 - May 2009
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oerlikon metco (singapore) pte. ltd.

Project Manager

Apr 2004 - Oct 2007
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